Integrated Analysis of Life Cycle Assessment With Carbon Footprint:Cases Study of Semiconductor Assembly Industry
碩士 === 國立中山大學 === 海洋環境及工程學系研究所 === 102 === This thesis, with the application of life cycle assessment, is meant to understand how the carbon footprint of an IC package product originates. Thus, its result will help reduce or improve the carbon footprint of the product. The Life Cycle Inventory Ana...
Main Authors: | CHEN-HUA WU, 吳貞樺 |
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Other Authors: | Lei yang |
Format: | Others |
Language: | zh-TW |
Published: |
2014
|
Online Access: | http://ndltd.ncl.edu.tw/handle/8fjr38 |
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