| Summary: | 碩士 === 國立中山大學 === 材料與光電科學學系研究所 === 102 === This study aimed at clarifying the effects of electroplating parameters, such as the electrolyte and pH value, and substrate roughness on the epitaxial growth of Ni on polycrystalline Cu substrates. The deposits were characterized by actomic force microscopy, scanning electron microscopy/electron backscatter diffraction and X-ray diffraction. Results indicated that no matter what texture was developed on the subsequent deposition, which was affected by the electroplating parameters, the epilayer grown on the (100) grains exhibited the greatest thickness and the lowest roughness value. Though both (111) and (100) Cu grains possessed a smooth surface after electro-polishing, the epitaxial growth on the (1111) Cu grains were clearly prohibited. Finally, the pyramid structures observed showed that the habit planes of the growth front are {100} instead of the close packed {111} planes.
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