Optimal Parameters Design Of Plasma Treatment Pre-Underfill For Flip Chip Device

• Main Authors: Chi-Huang Pan, 潘紀宏
• Other Authors: Jian-Long Kuo
• Format: Others
• Language: zh-TW
• Published: 2013
• Online Access: http://ndltd.ncl.edu.tw/handle/60907347489372657474

碩士 === 國立高雄第一科技大學 === 機械與自動化工程研究所 === 102 === In this thesis, focusing on high-end IC packaging products - stacked flip chip scale package (STKFCCSP), for plasma processing parameters to make the best of a study on the bottom after plasma treatment and plasma treatment gel glue width angle drops after impact on the product, the method used for the first use of Taguchi method in the development of process parameters, then use the response surface method for parameter optimization interval to find, and can simultaneously target multiple quality characteristics to meet the optimal parameter combination . Through this method of sorting out the two kinds of primer after plasma treatment and plasma treatment gum drops wide angle design the optimal combination of plasma processing parameters and, through real production parameters and the monitoring of its operations out of the results, that this optimization of the parameters of the plasma treatment can be effectively improved product quality.