Control of Spontaneous Tin Whisker Growth by Surface Treatment and the Effect of Residual Stress on Growth Kinetics
博士 === 國立中央大學 === 化學工程與材料工程學系 === 102 === In electronic package industry, the spontaneous growth of whiskers on tin thin films poses a threat to the reliability of electronic devices. These whiskers are produced by the continuous generation and relaxation of compressive stresses within the tin. The...
Main Authors: | Chien-Hao Su, 蘇建豪 |
---|---|
Other Authors: | 吳子嘉 |
Format: | Others |
Language: | zh-TW |
Published: |
2014
|
Online Access: | http://ndltd.ncl.edu.tw/handle/20280367571098307843 |
Similar Items
-
The Stress Effect for the Growth of Tin Whisker Study
by: Ching-I Lin, et al. -
The Suppression of Tin Whisker Growth by Surface Coating of Nano Particles and Surface Treatments
by: Yi-Chen Ding, et al.
Published: (2009) -
The Relation Between Tin Whisker Growth and Stresses,Temperatures
by: Tung-Hsien Lin, et al. -
Tin whisker growth in the communication industry.
by: Sabbah, N. A. J
Published: (1973) -
The Study of Tin Whisker Growth with Irregular Tin Grain Structure
by: Cheng-fu Yu, et al.
Published: (2010)