| Summary: | 碩士 === 國立交通大學 === 平面顯示技術碩士學位學程 === 102 === In this thesis the defects of the TFT-LCD module process were investigated. Applying the anisotropic conductive adhesive (ACF) and glass bonding in the driver IC bonding process utilizes the conductive particles of the ACF driver IC through the gold bumps and the conductive metal layer of ITO on glass to achieve the purpose of electrical conduction.
After Chip on glass (COG) process ,the light-leakage was occurred at a specific local area. Mainly because during the glass and the driver IC in COG process, the difference of the temperature gradient resulting in the different thermal expansion coefficient, which causes a partially panel warping leading the light leakage phenomenon.
Light leak has been a significant factor to affect the contras ratio, in order to produce the shorter and lighter displays, the thickness of the foundational glass substrate have been reduced rapidly, which signifies defects of more serious light leakage. Diagonal length of 13.3-inch and 0.3mm thick glass with a driver IC bonding semi-process displays were employed in the experiments, design of experiment was applied to identify the best conditions. The contrast in real display situation and light leakage value in dark screen were used to calculate the final ratio of light leakage for generate the best performance in dark screen also does not affect the quality and yields of production.
The results show that the Taguchi experimental design method narrows down the operational conditions for the driver IC bonding process and the optimum condition is determined by the factor of minimizing light leakage level. In addition, base line also keeping light leakage stably.
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