Temperature-Dependence Electromigration Failure for Flip-Chip SnAg Solder bumps with 5μm Cu metallization
碩士 === 國立交通大學 === 工學院半導體材料與製程設備學程 === 102 === As the consumer electronic products move toward lightly, thin, short and smaller, we need higher solder input/output joint density. Therefore, the evolution of the bonding technology has moved from “Wire Bonding” to “Flip Chip technology”. Along with the...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/nqb386 |