A study of innovative management of IC assembly on integrated component : the cases of L and S companies

• Main Authors: Wu, Wan-Hua, 吳萬華
• Other Authors: Chung, Hui-Min
• Format: Others
• Language: zh-TW
• Published: 2014
• Online Access: http://ndltd.ncl.edu.tw/handle/834yyh

碩士 === 國立交通大學 === 管理學院高階主管管理碩士學程 === 102 === ABSTRACT The semiconductor industry in Taiwan was very prosperous during 1990~2000,which makes Taiwan plays an important role in this industry. Taiwan ranked number two in global IC design industry, and ranks number one in both foundry services and IC packaging and testing services in the world. The fast development of semiconductor industry in China and southeast countries challenges the manufacturing industry of Taiwan especially in IC assembly and testing. Although Taiwan ranked one in packaging and testing services, it suffers from the fact of high revenue and low gross margin. Therefore, it is necessary to be innovative for Taiwan’s packaging and testing industry in order to maintain a competitive advantage and get rid of price-cutting competition. It is worth studying that how can a company do to concentrate the resources and start an innovation management. With the growing of the application on intellectual product, optical sensor, the core component used to strengthen human-computer interface and mainly apply to smart phones, becomes indispensable. According to the data from IDC, the quantity of smartphone in 2012 is up to 0.68 billion and the demand will keep on growing in 2013.In this study, we will discuss if it is possible to use the existing resources to attaining vertical integration. Furthermore, packaging and testing industry can upgrade themselves from low gross margin situation, change management, overcome environmental threats and then pursuit sustainable management by product innovation. With the product and the management of L and S companies, we hope we can summarize a suggestion to innovative management in order to get rid of the low gross margin situation and the risk of being eliminated. Therefore, Taiwanese IC packaging and testing industry will create new opportunity and lead the globe.