Integrated Resistance Welding for Microsystem Packaging
碩士 === 國立交通大學 === 機械工程系所 === 102 === This thesis studies the bounding properties of a novel method proposed our research group previously. This new techniques use resistance welding to achieve TLP bounding between two wafers, thus enabling the wafer level packing and testing. Investigation of th...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/31395202100348652433 |