Low Temperature Hybrid Bonding with 3D IC Heterogeneous Integration for LED Application
碩士 === 國立交通大學 === 電子工程學系 電子研究所 === 102 === Wafer bonding technique is one of the key technologies in 3D-IC applications. In this research, we develop the hybrid Cu/In to polymer/oxide low temperature bonding on heterogeneous substrates integration and propose a novel concept...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/y48pd5 |