Thermal Management with In-Situ Process-Temperature Sensor for TSV 3D Integration
碩士 === 國立交通大學 === 電子工程學系 電子研究所 === 102 === In TSV (through-silicon-via) 3D integrations, stacking multiple dies would face a severe challenge of the thermal stress and Vt scatter. In this thesis, a thermal management with an in-situ self-calibrated process-temperature (PT) sensor for TSV 3D-ICs is p...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/83875921479640529408 |