Fabrication and thermal stability of highly (111)-oriented nanotwinned Cu films and their applications in 3D IC packaging

博士 === 國立交通大學 === 材料科學與工程學系所 === 102 === This study investigates the fabrication, thermal stability, and applications in microelectronics packaging. This dissertation contains five parts. In the first part, we discussed the fabrication of highly (111)-orientated nano-twinned copper by pulse plating....

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Bibliographic Details
Main Authors: Huang, Yi-Sa, 黃以撒
Other Authors: Chen, Chih
Format: Others
Language:zh-TW
Published: 2014
Online Access:http://ndltd.ncl.edu.tw/handle/49958553110955192994

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