Fabrication and thermal stability of highly (111)-oriented nanotwinned Cu films and their applications in 3D IC packaging
博士 === 國立交通大學 === 材料科學與工程學系所 === 102 === This study investigates the fabrication, thermal stability, and applications in microelectronics packaging. This dissertation contains five parts. In the first part, we discussed the fabrication of highly (111)-orientated nano-twinned copper by pulse plating....
Main Authors: | Huang, Yi-Sa, 黃以撒 |
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Other Authors: | Chen, Chih |
Format: | Others |
Language: | zh-TW |
Published: |
2014
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Online Access: | http://ndltd.ncl.edu.tw/handle/49958553110955192994 |
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