Study of Thermal Stability of Nanotwinned and Electromigration Failure Mode for Microbumps with Nanotwinned Copper Metallization
碩士 === 國立交通大學 === 材料科學與工程學系所 === 102 === Nanotwinned copper has some outstanding properties that could be used in electronic device. In this study, the thermal stability of nanotwinned copper was investigated and used it as under-bump-metallization in microbump to analyze the failure mode with cur...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/74020703355269915535 |