Formation of Porous Cu3Sn Intermetallic Compounds at High Temperature in Low-bump-height solder joints

Formation of Porous Cu3Sn Intermetallic Compounds at High Temperature in Low-bump-height solder joints

碩士 === 國立交通大學 === 材料科學與工程學系所 === 102

Bibliographic Details
Main Authors:	Lin, Jie-An, 林皆安
Other Authors:	Chen, Chih
Format:	Others
Language:	zh-TW
Published:	2014
Online Access:	http://ndltd.ncl.edu.tw/handle/36685924121314509945

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