Formation of Porous Cu3Sn Intermetallic Compounds at High Temperature in Low-bump-height solder joints

Formation of Porous Cu3Sn Intermetallic Compounds at High Temperature in Low-bump-height solder joints

碩士 === 國立交通大學 === 材料科學與工程學系所 === 102

Bibliographic Details
Main Authors: Lin, Jie-An, 林皆安
Other Authors: Chen, Chih
Format: Others
Language:zh-TW
Published: 2014
Online Access:http://ndltd.ncl.edu.tw/handle/36685924121314509945
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spelling ndltd-TW-102NCTU51590342016-02-21T04:32:46Z http://ndltd.ncl.edu.tw/handle/36685924121314509945 Formation of Porous Cu3Sn Intermetallic Compounds at High Temperature in Low-bump-height solder joints 低高度銲錫接點在高溫下生成多孔狀Cu3Sn介金屬化合物之研究 Lin, Jie-An 林皆安 碩士 國立交通大學 材料科學與工程學系所 102 Chen, Chih 陳智 2014 學位論文 ; thesis 76 zh-TW
collection NDLTD
language zh-TW
format Others
sources NDLTD
description 碩士 === 國立交通大學 === 材料科學與工程學系所 === 102
author2 Chen, Chih
author_facet Chen, Chih
Lin, Jie-An
林皆安
author Lin, Jie-An
林皆安
spellingShingle Lin, Jie-An
林皆安
Formation of Porous Cu3Sn Intermetallic Compounds at High Temperature in Low-bump-height solder joints
author_sort Lin, Jie-An
title Formation of Porous Cu3Sn Intermetallic Compounds at High Temperature in Low-bump-height solder joints
title_short Formation of Porous Cu3Sn Intermetallic Compounds at High Temperature in Low-bump-height solder joints
title_full Formation of Porous Cu3Sn Intermetallic Compounds at High Temperature in Low-bump-height solder joints
title_fullStr Formation of Porous Cu3Sn Intermetallic Compounds at High Temperature in Low-bump-height solder joints
title_full_unstemmed Formation of Porous Cu3Sn Intermetallic Compounds at High Temperature in Low-bump-height solder joints
title_sort formation of porous cu3sn intermetallic compounds at high temperature in low-bump-height solder joints
publishDate 2014
url http://ndltd.ncl.edu.tw/handle/36685924121314509945
work_keys_str_mv AT linjiean formationofporouscu3snintermetalliccompoundsathightemperatureinlowbumpheightsolderjoints
AT línjiēān formationofporouscu3snintermetalliccompoundsathightemperatureinlowbumpheightsolderjoints
AT linjiean dīgāodùhànxījiēdiǎnzàigāowēnxiàshēngchéngduōkǒngzhuàngcu3snjièjīnshǔhuàhéwùzhīyánjiū
AT línjiēān dīgāodùhànxījiēdiǎnzàigāowēnxiàshēngchéngduōkǒngzhuàngcu3snjièjīnshǔhuàhéwùzhīyánjiū
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