The Influence of Process Parameters on the Mechanical Properties of Lapping Plate

• Main Authors: Chueh,Kun-Nan, 闕坤男
• Other Authors: Hsu,Ray-Quen
• Format: Others
• Language: zh-TW
• Published: 2013
• Online Access: http://ndltd.ncl.edu.tw/handle/96613939882004327400

碩士 === 國立交通大學 === 工學院精密與自動化工程學程 === 102 === ABSTRACT This study explores the influence that variations of abrasive grains and epoxy-based materials in different process parameters have on the mechanical properties of lapping plate. Mechanical properties can be examined using methods such as tensile and abrasion tests. Based on the tensile test results, the Young’s modulus of the lapping plate solidified and formed at 60 °C and 80 °C did not show substantial differences. However, the Young’s modulus of the lapping plate solidified and formed at 100 °C significantly declined by approximately 10%. Based on the abrasion test results, wheel strength increased and wheel wear decreased following an increase in the solidification temperature for the lapping plate. The analysis results of abrasive grain dispersion on the lapping plate material using scanning electron microscopy indicated that 25% epoxy content combined with abrasive grains demonstrated a clear agglomeration, which indirectly affected the overall structural strength of the lapping plate material.