Improving the Quality of Al Wire Bonding Process for LED Package using Design of Experiments- A Case Study of X Company

• Main Authors: Huang, Kun-Chi, 黃琨棋
• Other Authors: Tong, Lee-Ing
• Format: Others
• Language: zh-TW
• Published: 2014
• Online Access: http://ndltd.ncl.edu.tw/handle/z6j2dk

碩士 === 國立交通大學 === 管理學院工業工程與管理學程 === 102 === Lighting-Emitting Diode (LED) can be applied in many areas, such as indicators, lightings, backlights, displays and warning lights and so on. In the future, it is expected that LED will be completely replace the traditional tungsten lamp and has a bright perspective in the market. In LED package process, wire bonding is the most important sub-process. If the quality of wire bonding is unstable, it would affect the lighting function of LED seriously. Generally, the material of wire for LED can be divided as gold wire and aluminum wire. The cost of gold wire is much higher than aluminum wire. For the consideration of cost, aluminum wire is generally selected for wire bonding process. This study utilizes a SMD LED package company (X Company) in Taiwan as a case study. In order to maximize the wire pull, Box-Behnken Design of Design of Experiments (DOE) is employed to find out the optimal parameter setting for wire bonding machine and expect to enhance aluminum wire bonding quality during LED package process. The result of this study has proved that the wire pull process capability index (Cpk) has significantly increased by using the optimal parameter setting.