Fatigue Analysis for Free-Lead Flip-Chip Ball Grid Array Assembly
碩士 === 國立成功大學 === 機械工程學系 === 102 === This paper uses finite element software ANSYS14.0 to analyze the Flip-Chip Ball Grid Array packaging (FCBGA) under accelerated thermal cycling loading, we observe the thermal and mechanical behaviors of the solder balls and compare their fatigue life. First we h...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/70524369314766450655 |