| Summary: | 碩士 === 國立成功大學 === 機械工程學系 === 102 === This paper uses finite element software ANSYS14.0 to analyze the Flip-Chip Ball Grid Array packaging (FCBGA) under accelerated thermal cycling loading, we observe the thermal and mechanical behaviors of the solder balls and compare their fatigue life.
First we have to use ANSYS to establish the model of FCBGA and set up the material parameters, than describe solder ball's mechanical behaviors with Anand model, after that, mesh the model and analyze it by accelerated thermal cycling loading, finally we use Coffin-Manson equation to calculate solder balls fatigue life.
We use two lead-free materials and three type of models, first compare the mechanical behaviors of the same materials' solder ball in different types, than compare the mechanical behaviors of the different materials' solder ball in same types, eventually calculate the fatigue life and investigate the effect of solder ball with different material and model.
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