Improvement on the cutting and the dipping processes for miniaturized multilayer ceramic capacitors

碩士 === 國立成功大學 === 電機工程學系 === 102 === This research is using cutting and dipping machine as analysis equipment, with further discussion about bit displacement of cutting machine and bandwidth problems encountered while using dipping machine. Experimental procedure is divided into two parts, the first...

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Bibliographic Details
Main Authors: Ming-ZongYan, 顏明宗
Other Authors: Wen-Hsi Lee
Format: Others
Language:zh-TW
Published: 2014
Online Access:http://ndltd.ncl.edu.tw/handle/17487087415721136287
Description
Summary:碩士 === 國立成功大學 === 電機工程學系 === 102 === This research is using cutting and dipping machine as analysis equipment, with further discussion about bit displacement of cutting machine and bandwidth problems encountered while using dipping machine. Experimental procedure is divided into two parts, the first part is about bit displacement and further analyzing the effect of knife width, knife type, and angle to the product. Three different types of knives are used to perform reliability tests, to understand the advantages and disadvantages of each tool with respect to industry usage. Second part is regarding the dipping machine, Cu paste with different viscosity are applied to the material, using optical electron microscope we can observe micro-structure changes in bandwidth. The effects of dipping machine temperature on the Cu paste are also observed, so we can learn the effect of relative temperature difference to the bandwidth. This research objective is to reduce passive components plant cost, and in the course of the research, we found that different types of knives adjusted to different sizes of products could make passive components plant quickly implement the required product specifications and reduced waste of time.