Study the effect of the bump size on its deformation during Flip Chip Packaging.
碩士 === 國立成功大學 === 航空太空工程學系 === 102 === Flip Chip Package, which have high pin density and fine pitch, is one of the most important technologies into the integrated circuit packaging industry. It is also used in liquid crystal displays which is called chip on glass packaging processes. To simulate th...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/89319438043693800092 |