Interfacial Microstructures and Electrical Mechanism of Sn-xNi and SAC105 Alloys for Photovoltaic Module

• Main Authors: Tsung-MaoChuang, 莊琮貿
• Other Authors: Fei-Yi Hung
• Format: Others
• Language: zh-TW
• Published: 2014
• Online Access: http://ndltd.ncl.edu.tw/handle/62475483535252906920

碩士 === 國立成功大學 === 材料科學及工程學系 === 102 === The lead-free solders of Sn-1Ag-0.5Cu (SAC105) and Sn-xNi (x = 0.2, 0.5, 1 wt.%) were used in photovoltaic (PV) ribbons in this study that included two parts. First, the properties of solders contained microstructure, melting point and mechanical properties. Second part, the applicability of solders in PV module assessed their applicability by peeling test and interface microstructure. In order to accelerate experiment with high current density, which simulated the actual application how the interface transition of IMC affected the volume resistance of PV modules. After the electric test with high current density for 72 hours, all of silver layer transformed into Ag3Sn in positive zone. The formation of (Cu,Ni)6Sn5 at Sn-1Ni/Cu interface was prevented the formation of Cu3Sn and retarded the growth of IMC during the electric test. Although the PV ribbon of Sn-1Ni could inhibit the growth of IMC, but the thickness of IMC formed was larger during dipping and reflowing process, so the PV module of Sn-1Ni was still high volume resistance after electric test for 72 hours. Therefore, the addition of low Ni content PV ribbons could inhibit the generation of Cu3Sn phase and the thinness of IMC formed at Solder/Cu interface, so the photovoltaic module of Sn-0.2Ni had the lowest volume resistance than other PV modules. In terms of cost and application considerations for the PV ribbons of Sn-0.2Ni had potential. Keywords: Sn-Ni, Sn-Ag-Cu, Photovoltaic module, IMC