The Effect of Moisture on the Equivalent Strain for the Redistributed Chip Package through the 3-D Finite Element Analysis
碩士 === 國立成功大學 === 工程科學系 === 102 === In recent years, the moisture in the package has become the essential issue for research. The residual moisture always leads to the popcorn failure and then interfacial delamination within materials in the reflow process. Hence, the entire process of the package i...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/26896265656566976477 |