Using Project Management and Quality Control Circle Activities to Enhance Operating Efficiency -Taking the Semiconductor IC Packaging Die-attach Manufacturing Process of the L Company as an Example
碩士 === 國立勤益科技大學 === 資訊工程系 === 102 === Due to the rapid development of the semiconductor industry, now the IC wafer design and manufacture became more complicated and sophisticated. Therefore, packaging techniques must be enhanced simultaneously, so as to face the market competition and to enhance gl...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/hyp5f6 |