Investigation of defects of election-plating of Cu onto silicon hole substrate
碩士 === 國立勤益科技大學 === 化工與材料工程系 === 102 === Plating process of silicon substrate is a very important process and link for die stacking module。Small and beautiful appearance of the consumer market demand for electronic products and Semiconductor processing capability, fine pitch ability more go down， th...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/27668180159184599170 |