The Study of Elasto-plasticity in Chip Solder Balls under Hypothesis of Hyperelasticity
碩士 === 國立中興大學 === 機械工程學系所 === 102 === Electronic products have become an integral part in our daily life. The rapid development of the electronic industry technology makes electronic products miniaturization becoming a global trend; electronic packaging technology from the early wire bonding evoluti...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/79182413404846202243 |