Low-loss hybrid plasmonic waveguide applied in novelthrough-silicon via technologies

• Main Authors: Tang-Chin Hung, 洪堂欽
• Other Authors: 黃家健
• Format: Others
• Language: zh-TW
• Published: 2014
• Online Access: http://ndltd.ncl.edu.tw/handle/98049178334132873460

碩士 === 國立中興大學 === 物理學系所 === 102 === In the research we construct a hybrid low-loss plasmonic waveguide using the subwavelength mode area of plasmonic waveguides. The proposed structure is composed of a metallic nanowire covered by low-index silica, high-index silicon and low-index silica from inner to outer layers, respectively. By the metallic nanowire, the proposed structure is thus introduced in novel semiconductor through-silicon via (TSV) technologies and 3D integrated circuits processes. Moreover, we also study the coupling strengths of two parallel waveguides arranged in x and y directions for evaluating the integration density. The proposed structure is able to propagate beyond hundreds of micrometers with subwavelength mode areas because of the symmetric structure with respect to the metallic nanowire. These characteristics apparently help us compute precisely the compactness of TSV technologies and make that the proposed hybrid plasmonic waveguide is advantage to apply in the high-density integration of optical signal transporation.