Effect of the Plated Copper Thickness on the Output Power and Reliability for High Efficient Flip-Chip Light-Emitting Diodes

• Main Authors: Yi-Ching Su, 蘇宜清
• Other Authors: Shang-Ping Ying
• Format: Others
• Language: zh-TW
• Published: 2014
• Online Access: http://ndltd.ncl.edu.tw/handle/37553817067308591176

碩士 === 明新科技大學 === 電子工程研究所 === 102 === In this study, the output power and reliability of the different LED chips such as CREE TR5050 and CREE DA1000 with different plate copper thickness are proposed. With the optical characteristic measurements, the flip chip structure of CREE DA1000 emits more output power than the conventional structure of CREE TR5050. With the T3 Ster system measurements, the thermal resistance of CREE DA1000 is lower than the CREE TR5050. On the other hand, the CREE DA1000 chip with 30 μm copper thickness with good thermal characteristic emits more output power than the CREE DA1000 chip with different copper thickness. However, the CREE DA1000 chip with 15 μm copper thickness has the lowest thermal resistance with the T3 Ster system measurements. At the mean time, the CREE DA1000 chips with different alloy thickness have high reliability under different thermal and damp test. From thermal cycle test, the two different kinds of LED chips both have high reliability.