A Study on picosecond laser technology on 3D IC TSV and Low-k wafer grooving
碩士 === 義守大學 === 機械與自動化工程學系 === 102 === The aim of this research is to study the formation of TSV (through silicon via) by picosecond laser. Wafer thickness is 100 um and laser engine is green series. Experimental works are focused on micro precision process to observe the effect of silicon wafer mat...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/19538126640991168916 |