Silicon-Based LED Packaging Module with an Integrated RGB Color Sensor
碩士 === 逢甲大學 === 自動控制工程學系 === 102 === Thermal management is an important issue for LED packaging. In particular, high power LEDs are subject to high temperatures, which reduce the brightness and alter the color temperature, so external physical sensing devices, such as temperature and photo sensors,...
Main Author: | 陳君瑜 |
---|---|
Other Authors: | 鄒慶福 |
Format: | Others |
Language: | zh-TW |
Published: |
2014
|
Online Access: | http://ndltd.ncl.edu.tw/handle/10440531911946082646 |
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