Silicon-Based LED Packaging Module with an Integrated RGB Color Sensor

碩士 === 逢甲大學 === 自動控制工程學系 === 102 === Thermal management is an important issue for LED packaging. In particular, high power LEDs are subject to high temperatures, which reduce the brightness and alter the color temperature, so external physical sensing devices, such as temperature and photo sensors,...

Full description

Bibliographic Details
Main Author: 陳君瑜
Other Authors: 鄒慶福
Format: Others
Language:zh-TW
Published: 2014
Online Access:http://ndltd.ncl.edu.tw/handle/10440531911946082646
id ndltd-TW-102FCU05146004
record_format oai_dc
spelling ndltd-TW-102FCU051460042015-10-13T23:49:49Z http://ndltd.ncl.edu.tw/handle/10440531911946082646 Silicon-Based LED Packaging Module with an Integrated RGB Color Sensor 具有RGB色彩感測器之LED構裝模組 陳君瑜 碩士 逢甲大學 自動控制工程學系 102 Thermal management is an important issue for LED packaging. In particular, high power LEDs are subject to high temperatures, which reduce the brightness and alter the color temperature, so external physical sensing devices, such as temperature and photo sensors, and heat dissipation apparatus with control circuits are necessary, to modulate the operating temperature. However, these additions increase packaging volume, integral complexity and cost. To address the above problems, a silicon-based LED packaging module with an integrated RGB color sensor is proposed in this study. The design concept uses MEMS process and monolithic integration technology to fabricate photo sensor with RGB color photoresist on a silicon wafer for the modular packaging with LED. The RGB photo sensors used to detect the brightness and intensity of light source in specified wavelengths, and therefore the optical characterization in this packaging level can be identified for real time control. In which, the photosensitive element and LED carrier structure are directly fabricated on a silicon wafer, using ion doping, color photoresist spin coating and inductively coupled plasma etching, thereby achieving a smart LED packaging module featuring miniaturization, integration and low cost. This method reduces the cost and promotes its applications due to the system in packaging (SIP) at a wafer level. The dimensions of single module were 1×1 cm2; the light source is a 1-watt blue ray LED encapsulated yellow phosphor. Based on above measurement result, the brightness, chromaticity and color temperature of the LED packaging module can be identified during operation process. 鄒慶福 2014 學位論文 ; thesis 68 zh-TW
collection NDLTD
language zh-TW
format Others
sources NDLTD
description 碩士 === 逢甲大學 === 自動控制工程學系 === 102 === Thermal management is an important issue for LED packaging. In particular, high power LEDs are subject to high temperatures, which reduce the brightness and alter the color temperature, so external physical sensing devices, such as temperature and photo sensors, and heat dissipation apparatus with control circuits are necessary, to modulate the operating temperature. However, these additions increase packaging volume, integral complexity and cost. To address the above problems, a silicon-based LED packaging module with an integrated RGB color sensor is proposed in this study. The design concept uses MEMS process and monolithic integration technology to fabricate photo sensor with RGB color photoresist on a silicon wafer for the modular packaging with LED. The RGB photo sensors used to detect the brightness and intensity of light source in specified wavelengths, and therefore the optical characterization in this packaging level can be identified for real time control. In which, the photosensitive element and LED carrier structure are directly fabricated on a silicon wafer, using ion doping, color photoresist spin coating and inductively coupled plasma etching, thereby achieving a smart LED packaging module featuring miniaturization, integration and low cost. This method reduces the cost and promotes its applications due to the system in packaging (SIP) at a wafer level. The dimensions of single module were 1×1 cm2; the light source is a 1-watt blue ray LED encapsulated yellow phosphor. Based on above measurement result, the brightness, chromaticity and color temperature of the LED packaging module can be identified during operation process.
author2 鄒慶福
author_facet 鄒慶福
陳君瑜
author 陳君瑜
spellingShingle 陳君瑜
Silicon-Based LED Packaging Module with an Integrated RGB Color Sensor
author_sort 陳君瑜
title Silicon-Based LED Packaging Module with an Integrated RGB Color Sensor
title_short Silicon-Based LED Packaging Module with an Integrated RGB Color Sensor
title_full Silicon-Based LED Packaging Module with an Integrated RGB Color Sensor
title_fullStr Silicon-Based LED Packaging Module with an Integrated RGB Color Sensor
title_full_unstemmed Silicon-Based LED Packaging Module with an Integrated RGB Color Sensor
title_sort silicon-based led packaging module with an integrated rgb color sensor
publishDate 2014
url http://ndltd.ncl.edu.tw/handle/10440531911946082646
work_keys_str_mv AT chénjūnyú siliconbasedledpackagingmodulewithanintegratedrgbcolorsensor
AT chénjūnyú jùyǒurgbsècǎigǎncèqìzhīledgòuzhuāngmózǔ
_version_ 1718087004085813248