A study of using Lean Value Stream Mapping and IE Theory on IC packaging process.

• Main Authors: Po-han Chen, 陳柏翰
• Other Authors: 鄭豐聰
• Format: Others
• Language: zh-TW
• Published: 2014
• Online Access: http://ndltd.ncl.edu.tw/handle/8zrh5m

碩士 === 逢甲大學 === 工業工程與系統管理學系 === 102 === The global of IC industry is towards to highly specialized division of labor. The IC industry in Taiwan has an important status both in IC design, manufacturing, packaging and testing. Functions continuous innovation on electronic products, and trend lighter, thinner, shorter, high-end process forward in today. How can we able to survive in packaging technology continues to progress, and intense global competitive environment, and customers continue to face higher quality requirements, shorter delivery and increasing production costs become a major challenge for the current. Improvements in lean production techniques and concepts in manufacturing and services have been widely used in recent years. Companies have to think about that how to make continuous improvements to reduce waste and increase the competitiveness of enterprises. There weren&;#39;t much study about the actual application results of Lean Value Stream Mapping tool in IC packaging. They mostly offered corporate of design ideal future based on Lean philosophy. This study will combine Lean Value Stream, IE&;#39;s Work Study of Process Analysis and Time Study, and use the most common scale to measure-time, and figure out the bottleneck in the production process. Use appropriate IE improvement tools to analyze and actual verification. The results of this study showed that Lean tool combine with IE tool applications, it got significant improvements in Lead Frame’s process of the IC packaging industry. The result of improvement was described as follows: FS station&;#39;s process time has reduction by 5.6%, lead time has reduction by 15%, WIP has reduction by 19%, overall production process has reduction by 1.4%, and we got higher UPD. Finally, we also found that the bottleneck was transferred to other process. This study showed the success of combination between Lean tool and IE tool applications. We hope this previous improving thinking will be able to adopt in IC packaging industry, using continuous improvement Production process to achieve the smooth flow target for the company to seek more and more profits.