Improvements of Plasma Cleaning and Scrub Mode on the 2nd Bond in Cu Wire-bonding Process
碩士 === 建國科技大學 === 電子工程系暨研究所 === 102 === In this thesis, we are focusing on the strength between copper wire and silver plating layer which are affected by the setting of the scrub on/off mode in 2nd bond process and the plasma cleaning. Also, other required bonding process qualities are being analyz...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/04759639983526912095 |