The Study Of Electroplated Copper Film Uniformity Improvement On A Silicon Wafers
碩士 === 正修科技大學 === 電機工程研究所 === 102 === In this study, we discussed operating conditions and plating tank design affecting for copper plating.Using Optical microscope analysis and observation.We adjust the current and design working electrode. This study found that by changing the design and flow of...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/34396860874432622255 |