Functional Material Package with Structure forOptoelectronic Device Applications
博士 === 元智大學 === 光電工程學系 === 101 === In this thesis, various ultraviolet (UV) curable polymeric nanocomposites has been prepared by conventional heating method, fast UV illumination as well as rapid microwave irradiation and applied for the encapsulation of optoelectronic devices, brightness enhanceme...
Main Authors: | Jian-Shian Lin, 林建憲 |
---|---|
Other Authors: | Nien-Po Chen |
Format: | Others |
Language: | en_US |
Online Access: | http://ndltd.ncl.edu.tw/handle/35929593490623042732 |
Similar Items
-
Light-Controlled Self-Assembly of Ge/Si Quantum Dots forOptoelectronic Devices
by: Shao-Tsung Huang, et al.
Published: (2014) -
Risk Assessment of TCE-contaminated Groundwater forOptoelectronics Industry : A Case Study.
by: Wen-Chung Hung, et al.
Published: (2006) -
Interfacial Stabilities and Materials Characterizaztions in Optoelectronic Devices and Packaging Modules
by: Shih-kang Lin, et al.
Published: (2008) -
Optoelectronic Materials, Devices, and Applications
Published: (2023) -
Optoelectronic devices and packaging for information photonics
by: Kumpatla, Srinivasarao
Published: (2009)