Interfacial reaction and mechanical properties between Sn-Ag-Cu alloy and submicron Ni(P) metallization pads
碩士 === 元智大學 === 化學工程與材料科學學系 === 101 === Recently, thin Ni(P) films (less than 1 μm in thickness) have received significant attention from the electronic industry because they offer greater bondability with Cu wires and less magnetic effect than do thick Ni(P). However, submicron Ni(P) films are app...
Main Authors: | Chia-Wei Fan, 范家瑋 |
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Other Authors: | Cheng-En Ho |
Format: | Others |
Language: | zh-TW |
Online Access: | http://ndltd.ncl.edu.tw/handle/92896982361389308716 |
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