Dependence of Palladium Thickness on the Lead-free Soldering Reaction and Mechanical Reliability
博士 === 元智大學 === 化學工程與材料科學學系 === 101 === Recently, lead-free soldering activities in global electronic industry have pushed PCB and chip carrier board manufacturers to seek a more adequate surface finish for soldering with lead-free alloys, so as to advance the mechanical strength of each joint and t...
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| Format: | Others |
| Language: | en_US |
| Online Access: | http://ndltd.ncl.edu.tw/handle/76279542886913511569 |