Investigation of Visualization Technology and Application and Numerical Simulation on the Molding Filling of UV Resin Embossing

• Main Authors: Chun-Ming Chung, 鍾俊銘
• Other Authors: Shi-Chang Tseng
• Format: Others
• Language: zh-TW
• Published: 2013
• Online Access: http://ndltd.ncl.edu.tw/handle/38151557241858844040

碩士 === 國立雲林科技大學 === 機械工程系碩士班 === 101 === The micro embossing process have emphasized about the low flow rate of material, short liquidity and large region of embossing. It’s more suitable for the optical device, biological chips, optical communication industry and solar micro structure. The processing is quite simple and suitable for reproduce repeatability. It’s the core technique to reduce cost and to improve the quantity of product. Previous researchers had focused on simulation about the behavior of mold flow. This study aims to research about the flow activity with capillary number. Using the ployflow to predict the rheological behavior in the micro embossing process, installed visualization equipment with embossing processing experiment, observed the flow behavior with instant photography and observed the influence of capillary number inmicro embossing process. The simulation results agree with experimental observation. The formation of single peak and double peak can be captured.