Investigations for the Interfacial Micro-contact Temperature Rise of Soft Pad Polishing Process
碩士 === 吳鳳科技大學 === 光機電暨材料研究所 === 101 === Soft-pad polishing is a key technology for fine surface finish and planarization. During the soft-pad polishing process, the temperature between the polishing interfaces will increase due to the friction and wear effects. The interfacial polishing temperature...
Main Authors: | Yang Shih Chia, 楊適嘉 |
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Other Authors: | Huang Pay Yau |
Format: | Others |
Language: | zh-TW |
Published: |
2013
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Online Access: | http://ndltd.ncl.edu.tw/handle/13768989370780069574 |
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