Investigations for the Interfacial Micro-contact Temperature Rise of Soft Pad Polishing Process

• Main Authors: Yang Shih Chia, 楊適嘉
• Other Authors: Huang Pay Yau
• Format: Others
• Language: zh-TW
• Published: 2013
• Online Access: http://ndltd.ncl.edu.tw/handle/13768989370780069574

碩士 === 吳鳳科技大學 === 光機電暨材料研究所 === 101 === Soft-pad polishing is a key technology for fine surface finish and planarization. During the soft-pad polishing process, the temperature between the polishing interfaces will increase due to the friction and wear effects. The interfacial polishing temperature plays a central role in the soft-pad polishing process and can affect the polishing outcomes. To investigate the polishing temperature rise mechanism during soft-pad polishing process, the current study utilizes dynamic mechanical analysis technique to characterize the micro mechanical property of polishing pad surface under various conditions. The measured data has been applied to the development of the interfacial contact mechanism and polishing temperature rise theoretical model. In this research, a polishing temperature model considering the effects of operating parameters, consumables’ characteristics and soft-pad properties is developed. The effects of operating and consumables’ parameters to the soft-pad polishing temperature rise are also investigated by the developed model.