| Summary: | 碩士 === 淡江大學 === 國際商學碩士在職專班 === 101 === In consumer electronics, driven by the growth trend to put more features into a smaller volume, and achieve energy saving, high efficiency and low cost IC products that consumers are looking for. The engineers have finally officially in 2009 brought the product to meet the "Information plus Communication" years , in order to meet human demand : if anytime you want to the information function and wireless communication fun. The new generation of the end product is a set of trends in Communication / IT / Multimedia in one machine.
This study investigates the evolution of semiconductor packaging technology with 3D-TSV industry status and future trends in the literature, based on the established framework of this study. In this study, industrial analysis to understand the general environment of the semiconductor packaging industry background and current status. Secondly, in-depth case study company''s marketing strategy and its competitive advantage. Finally, this study SWOT analysis, combined with the company''s existing case resources and capabilities made Case A company''s future development and suggestions.
After an analysis of the case N company through research, collate and conclusions are as follows:
1.The Advanced semiconductor packaging technology 3D-TSV development of increasingly strong, sustained towards consumer electronics, handheld devices application goals.
2.Industrial supplier of electronic materials, the face of rapid technological evolution, corresponding to customer demand Items Quality and self-test capability, it should go beyond, leading customers technical level.
3.Cultivating existing sales channels, and look for opportunities to work with the upstream IC design company, or indicative of the customer to strategic alliances, collaborative development materials, increased material is directly specified using the opportunity to advantage.
4.Driven 3D-TSV industry supply chain, and customer share development opportunities.
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