Study on the Performance of Thin Vapor Chamber in Different Vapor Flow Space and Wick Modification
碩士 === 國立臺北科技大學 === 製造科技研究所 === 101 === 3C products have been designed toward thinner and tiny scale as a result of attracting more attention of consumers. Thus, the improved efficiency of heat dissipation for electronic devices is a difficult challenge. Vapor chamber is one kind of cooling system...
Main Authors: | Tz-Ming Huang, 黃子明 |
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Other Authors: | Cherng-Yuh Su |
Format: | Others |
Language: | zh-TW |
Published: |
2013
|
Online Access: | http://ndltd.ncl.edu.tw/handle/btkw8r |
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