| Summary: | 碩士 === 國立臺北科技大學 === 管理學院工業工程與管理EMBA專班 === 101 === As technology continues to progress and products revolutionize, the requirements to consuming electronic products also increase. In order to meet consumer demand, chip design companies toward a more powerful, less power consumption, smaller chip and packaging size product design. Manufacturers adopt advanced process and alternative materials to be more competitive with respect to pricing, quality and reliability. In recent years, the increase of gold price have significantly increased the cost of semiconductor packaging. Assembly houses intend to replace gold wire with copper wire for the connection of integrated circuits to the packaging materials. In general, it is expect to reduce the packaging costs by 10% to 30% if copper wire is implemented. However, the actual benefits will vary depending on the applications, the package type and the production environment. Only taking into account the cost of materials is not enough, need to take into account other facet, because of the different facets benefits are not the same.
This study explores the benefits of implementing copper wire process from aspects of both quality appraisal cost and process cost. We consider equipment costs, material costs, manufacturing costs, reliability testing costs, etc. Regarding to the copper wire bonding process, the process cycle time is longer, requiring more strict production control, while the process yield and quality are comparable to gold wire bonding. Results of reliability testing indicates that the performance of copper wire and gold wire are similar, i.e. the copper wire may successfully replaced the gold wire. Cost-benefit comparisons are done based on the analysis through net present value, benefit-cost ratio, internal rate of return. The results show that the implementation of copper wire bonding can bring benefits for the enterprise. Finally, results of sensitivity analysis indicate that the cost performance of copper wire bonding is more significant as package pin count increases. This means that the copper wire bonding is more beneficial to the higher function semiconductor packaging industry.
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