A Molecular Dynamics Simulation of Stress and Strain Behaviors of Cu/Al Bimetal Micro-Structure under Tensile Force

• Main Authors: Chiuan-Guo Jen, 全國禎
• Other Authors: Hsing-Sung Chen
• Format: Others
• Language: zh-TW
• Published: 2013
• Online Access: http://ndltd.ncl.edu.tw/handle/2ra2c5

碩士 === 國立虎尾科技大學 === 材料科學與綠色能源工程研究所 === 101 === In this study is the use of molecular dynamics to simulation cu/al bimetal in the presence or absence of cracks, as well as in different permutations way to explore the stress distribution and micro-structure changes. The Simulation method is to use the Tight-Binding potential function method and Verlet table columns adjacent to describe metal intermolecular forces; and use the Gear fifth-order correction prediction method to calculate the atom due to an external force displaced position, velocity and acceleration. According to The simulation results that: either the specimen presence or absence to cracks,in the microscopic system exists a prestress value, and the presence of cracks is positive; specimen is stretched to the breaking effect will produce a slight rear shock stress, especially in the there are cracks in the case are obvious. When the cracks in the specimen, either the copper / aluminum bimetal what order, breaking sections will extend from the crack location. When the specimen is not present cracks,gaps starting from where the specimen thinner area.