| Summary: | 碩士 === 國立虎尾科技大學 === 工業工程與管理研究所 === 101 === Surface Mount Technology (SMT) of memory module products has been trending to light, thin, short, small, high-capacity and high-speed operation in recently. For printing process of printed circuit board, it has been becoming increasingly important when it meets advanced SMT. In this study, it focuses on SMT printing process of printed circuit board and proposes Taguchi design of experiment (DOE), in order to enhance the stability of the print quality and reduce production lead-time wasted. First use Measurement Systems Analysis (MSA) to evaluate the SPI machine thickness of the solder paste measurement capability to confirm the measurement system repeatability and reproducibility (Gauge Repeatability & Reproducibility, GR&R) meets requirements. Then use Taguchi method to work out print experiment, and then observes solder paste thickness factor, combines with the analysis of variance (ANOVA) to design the best combination of parameters, and in the end verify the results of the overall solder paste thickness CPK improvement increased from the original 1.132 to 1.775. The solder paste printing will obtain the best combination of parameters available to the manufacturers of reference.
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