Interfacial Reaction of Different Solders in Solar Cell Interconnect

Interfacial Reaction of Different Solders in Solar Cell Interconnect

碩士 === 國立臺灣大學 === 材料科學與工程學研究所 === 101 ===

Bibliographic Details
Main Authors:	Kuan-Yu Huang, 黃冠育
Other Authors:	高振宏
Format:	Others
Language:	zh-TW
Published:	2013
Online Access:	http://ndltd.ncl.edu.tw/handle/19790384386205962684

Similar Items

The Effects of the Solder Composition on Interfacial Reactions in Flip-Chip Solder Joints
by: Chih-Chiang Chang, et al.
Published: (2010)

Size and interfacial reactions effects upon undercooling of Pb-free solders
by: Kuan-Hsien Wu, et al.
Published: (2008)

Effect of Magnesium on Interfacial Reaction and Microstructures of Lead-Free Solders
by: Wei- Chia Huang, et al.
Published: (2011)

The Effect of Convection Upon the interfacial Reactions in the Soldering Process
by: 林朝青
Published: (1998)

Interfacial reaction and joint strength of In-Bi solder on Cu substrate
by: Jeng-Yu Chiang, et al.
Published: (2018)

Interfacial Reaction and Mechanical Properties of Sn-Bi Solder joints
by: Fengjiang Wang, et al.
Published: (2017-08-01)

THE CROSS-INTERACTION OF TWO INTERFACIAL REACTIONS IN SOLDER JOINTS
by: Chien-wei Chang, et al.
Published: (2007)

Coupling Effects between Two Interfacial Soldering Reactions in Flip-Chip Solder Joint
by: Shen-Jie Wang, et al.
Published: (2006)

The Research of Lead-Free Solder Interfacial Reaction in UCSP Package
by: Jun-Yuan Chen, et al.
Published: (2004)

Interfacial Reactions in Flip-Chip High-Lead Solder Joint
by: Kai-Jheng Wang, et al.
Published: (2006)

Interfacial Reactions and Adhesion Strength of Sn-In Eutectic Solder on Copper
by: Ying-Chao Hsu, et al.
Published: (2001)

Effects of Active Alloy Elements on the Solder Properties and Interfacial Reactions
by: Yen-Huan Lei, et al.
Published: (2015)

Interfacial Reaction Between Solder Tin and Bismuth Telluride Substrate
by: Shan Ye, et al.
Published: (2014)

Investigation of interfacial reaction and microstructure of high temperature solder joint
by: Wei-ShiuanWu, et al.
Published: (2015)

The Interfacial Reaction of SnAgIn Pb-Free Solder on Cu Substrates
by: Yu-Yen Chiang, et al.
Published: (2010)

Effects of Fe Additions upon Interfacial Reactions between Solders and Substrates
by: Chia-Yu Wei, et al.
Published: (2017)

Investigation on Interfacial Reactions between Electroless Co-P and Lead-free Solders
by: Huang, Shengen, et al.
Published: (2012)

Reaction kinetics at the interface of Ni-based under bump metallization in solder joints
by: Kuan-Chih Huang, et al.
Published: (2012)

Fundamentals of solder interconnect wetting
by: Kang, Suk Chae
Published: (2007)

The Effect of Different In Content on Interfacial Reactions and Growth Kinetics between Sn-In Solders and Cu Substrate
by: Dai-Ru Yang, et al.
Published: (2009)

The study of interfacial reaction between SnBi solder and Au substrate
by: Zhao-Ming Chen, et al.
Published: (2008)

Development of Low Melting Solder Alloy and Analysis of Interfacial Reaction and Reliability
by: Chih-Hao Chen, et al.
Published: (2017)

Dissolution and Interfacial Reaction between Cu and Sn-Ag-Cu Solders
by: Chih-Chiang Chang, et al.
Published: (2007)

An Interfacial Reaction Study on the Solder Joint of the Rework Lead Free Components
by: Ming-chuan Chen, et al.
Published: (2005)

Interfacial reactions and intermetallic growth kinetics in Sn-Zn solder system
by: Hsien-Hsin Chen, et al.
Published: (2010)

Investigation on Interfacial Reactions between Lead-free Solders and Cobalt Substrate
by: Chun-Yi Kuo, et al.
Published: (2010)

Interfacial reactions and microstructural evolutions of the solder joints in electronic and thermoelectric devices
by: Chao-hong Wang, et al.
Published: (2008)

Interfacial reactions of lead-free solders with electroless palladium on the nickel substrate
by: Li, Poyi, et al.
Published: (2012)

Interfacial Reactions of Lead-Free Solders with the Ni-xPd Alloys
by: Yi-shan Li, et al.
Published: (2014)

Interfacial Reactions of Lead-free Solders with the Cu-xZn Alloys
by: Guan-Da Chen, et al.
Published: (2014)

The interfacial reaction between Sn-Zn series solders and Ag substrate
by: Pei-Chi Liu, et al.
Published: (2004)

Interfacial reactions of Au-20wt.%Sn solder on Cu substrate
by: Hsiang-Mou Chung, et al.
Published: (2009)

Interfacial Reactions between Ni Substrate and Microelectronics BiSn Solder
by: Chi Chen, et al.
Published: (1999)

Study on the reliability of an ultrasonic assisted soldering applied to fabricate solar cell interconnects on the silicon substrate
by: Shao-An Chien, et al.
Published: (2018)

Study on the process of an ultrasonic assisted soldering applied to fabricate solar cell interconnects on the silicon substrate
by: Guan-Heng Pan, et al.
Published: (2016)

Analysis of interfacial reaction during the formation of Pb-free solder joint
by: Chee-Key Chung, et al.
Published: (2012)

A study of interfacial reaction between molten Sn-Ag solder and Te substrate
by: Huang, Yen-Chun, et al.
Published: (2009)

Study on Electromigration of Flip-Chip Solder Interconnect
by: Hsiung-Nien Huang, et al.
Published: (2004)

Effects of mechanically applied stress on tin whisker growth and interfacial reactions at solder joints
by: Yu-Jen Chen, et al.
Published: (2009)

Effect of Sn Addition to Cu Substrate on the Interfacial Reaction with Lead Free Solder
by: Tzu-Hsuan Chiu, et al.
Published: (2019)