Thin Film Solid-Liquid Interdifusion Bonding of Thermoelectric Materials with Cu Electrode
博士 === 國立臺灣大學 === 材料科學與工程學研究所 === 101 === Thermoelectric materials have gained attention in recent years for use in green energy applications that involve the exchange of heat energy and electrical energy. Traditionally, soldering or brazing methods are employed for the bonding of thermoelectric ma...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/13514911671618006267 |