To Increase Burn-in Temperature in Accelerated Life Tests – Some Case Studies on PMIC

碩士 === 國立臺灣海洋大學 === 電機工程學系 === 101 === In this research, there are two ways to estimate the Reliability on the IC products, first source was using the sampling project on the chart " MIL-S-1955 LTPD (Lot Tolerance Percent Defective) and the second source was the suggesting life span method in t...

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Bibliographic Details
Main Authors: Chun-Chi Chen, 陳俊輯
Other Authors: Li, Jung-Chien
Format: Others
Language:zh-TW
Published: 2013
Online Access:http://ndltd.ncl.edu.tw/handle/g9z986
Description
Summary:碩士 === 國立臺灣海洋大學 === 電機工程學系 === 101 === In this research, there are two ways to estimate the Reliability on the IC products, first source was using the sampling project on the chart " MIL-S-1955 LTPD (Lot Tolerance Percent Defective) and the second source was the suggesting life span method in the JESD85.Furthermore, according to the bathtub curve of the IC lifetime cycle, estimating process should use HTOL (High Temperature Operating Lifetime) to test the manufactures of Power management IC. Under any circumstance, the burn-in procedure should be only tested between 125℃HTOL and 130℃HTOL and compare the distributive curves from the two different temperatures for analyzing the tested items. For further research purposes, try to raise the burn-in temperature to see how it influence the time change while testing.