The Response Test and Thermal Resistance Analysis of the Junction Temperature for the LED under Different Thermal Interfacial Material

碩士 === 國立清華大學 === 工程與系統科學系 === 101 === 因申請專利緣故，資料延後公開

Bibliographic Details
Main Authors:	Chen, Bo-Ruei, 陳柏睿
Other Authors:	林唯耕
Format:	Others
Language:	zh-TW
Published:	2013
Online Access:	http://ndltd.ncl.edu.tw/handle/77860411862644448863

id	ndltd-TW-101NTHU5593025
record_format	oai_dc
spelling	ndltd-TW-101NTHU55930252015-10-13T22:06:56Z http://ndltd.ncl.edu.tw/handle/77860411862644448863 The Response Test and Thermal Resistance Analysis of the Junction Temperature for the LED under Different Thermal Interfacial Material 發光二極體接端溫度在不同熱介面材料下之響應測試與熱阻分析 Chen, Bo-Ruei 陳柏睿碩士國立清華大學工程與系統科學系 101 因申請專利緣故，資料延後公開林唯耕 2013 學位論文 ; thesis 103 zh-TW
collection	NDLTD
language	zh-TW
format	Others
sources	NDLTD
description	碩士 === 國立清華大學 === 工程與系統科學系 === 101 === 因申請專利緣故，資料延後公開
author2	林唯耕
author_facet	林唯耕 Chen, Bo-Ruei 陳柏睿
author	Chen, Bo-Ruei 陳柏睿
spellingShingle	Chen, Bo-Ruei 陳柏睿 The Response Test and Thermal Resistance Analysis of the Junction Temperature for the LED under Different Thermal Interfacial Material
author_sort	Chen, Bo-Ruei
title	The Response Test and Thermal Resistance Analysis of the Junction Temperature for the LED under Different Thermal Interfacial Material
title_short	The Response Test and Thermal Resistance Analysis of the Junction Temperature for the LED under Different Thermal Interfacial Material
title_full	The Response Test and Thermal Resistance Analysis of the Junction Temperature for the LED under Different Thermal Interfacial Material
title_fullStr	The Response Test and Thermal Resistance Analysis of the Junction Temperature for the LED under Different Thermal Interfacial Material
title_full_unstemmed	The Response Test and Thermal Resistance Analysis of the Junction Temperature for the LED under Different Thermal Interfacial Material
title_sort	response test and thermal resistance analysis of the junction temperature for the led under different thermal interfacial material
publishDate	2013
url	http://ndltd.ncl.edu.tw/handle/77860411862644448863
work_keys_str_mv	AT chenboruei theresponsetestandthermalresistanceanalysisofthejunctiontemperaturefortheledunderdifferentthermalinterfacialmaterial AT chénbǎiruì theresponsetestandthermalresistanceanalysisofthejunctiontemperaturefortheledunderdifferentthermalinterfacialmaterial AT chenboruei fāguāngèrjítǐjiēduānwēndùzàibùtóngrèjièmiàncáiliàoxiàzhīxiǎngyīngcèshìyǔrèzǔfēnxī AT chénbǎiruì fāguāngèrjítǐjiēduānwēndùzàibùtóngrèjièmiàncáiliàoxiàzhīxiǎngyīngcèshìyǔrèzǔfēnxī AT chenboruei responsetestandthermalresistanceanalysisofthejunctiontemperaturefortheledunderdifferentthermalinterfacialmaterial AT chénbǎiruì responsetestandthermalresistanceanalysisofthejunctiontemperaturefortheledunderdifferentthermalinterfacialmaterial
_version_	1718073814731980800

The Response Test and Thermal Resistance Analysis of the Junction Temperature for the LED under Different Thermal Interfacial Material

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