On the Thermal Performance Analysis of Three-dimensional Chip Stacking Electronic Packaging with Through Silicon Vias
碩士 === 國立清華大學 === 動力機械工程學系 === 101
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| Language: | zh-TW |
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2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/93131981971597301077 |
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ndltd-TW-101NTHU5311067 |
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ndltd-TW-101NTHU53110672015-10-13T22:29:57Z http://ndltd.ncl.edu.tw/handle/93131981971597301077 On the Thermal Performance Analysis of Three-dimensional Chip Stacking Electronic Packaging with Through Silicon Vias 含矽穿孔三維晶片堆疊電子構裝之散熱效能分析 黃子晉 碩士 國立清華大學 動力機械工程學系 101 陳文華 鄭仙志 2013 學位論文 ; thesis 69 zh-TW |
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NDLTD |
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zh-TW |
| format |
Others
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| sources |
NDLTD |
| description |
碩士 === 國立清華大學 === 動力機械工程學系 === 101 |
| author2 |
陳文華 |
| author_facet |
陳文華 黃子晉 |
| author |
黃子晉 |
| spellingShingle |
黃子晉 On the Thermal Performance Analysis of Three-dimensional Chip Stacking Electronic Packaging with Through Silicon Vias |
| author_sort |
黃子晉 |
| title |
On the Thermal Performance Analysis of Three-dimensional Chip Stacking Electronic Packaging with Through Silicon Vias |
| title_short |
On the Thermal Performance Analysis of Three-dimensional Chip Stacking Electronic Packaging with Through Silicon Vias |
| title_full |
On the Thermal Performance Analysis of Three-dimensional Chip Stacking Electronic Packaging with Through Silicon Vias |
| title_fullStr |
On the Thermal Performance Analysis of Three-dimensional Chip Stacking Electronic Packaging with Through Silicon Vias |
| title_full_unstemmed |
On the Thermal Performance Analysis of Three-dimensional Chip Stacking Electronic Packaging with Through Silicon Vias |
| title_sort |
on the thermal performance analysis of three-dimensional chip stacking electronic packaging with through silicon vias |
| publishDate |
2013 |
| url |
http://ndltd.ncl.edu.tw/handle/93131981971597301077 |
| work_keys_str_mv |
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