Novel Low-Temperature Direct Joining Type Cu-Alloy Pastes for Silicon Solar Cells
碩士 === 國立屏東科技大學 === 材料工程研究所 === 101 === This study is divded into two parts：(1)Use four kinds of low temperatrue SB system(SB1C,SB4T,SB4TC and SB1TA) active solders is bonding with Cu substrate and Si chip, and then analysis of microstructure,mechanical properties and fracture surface.(2)The SB past...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/59950252710328484964 |